UIUC-NYCU MSE (3+2) 2026 Fall semester 開始申請!

Required application documents:
1. Cover Page

2. Official Academic Transcript in Chinese (must include cumulative GPA and class ranking)
   3. TOEFL or IELTS Scores (within the last two years)
   4. Statement of Purpose (no specific format required)
   5. Study Plan (How many credits have been completed so far? What courses will be completed in the second semester of your junior year? Which courses will be taken at UIUC?) (no specific format required)

欲申請的同學請於114年11月20日(四)下午4點前將以上文件電子檔寄至chhsu0909@nycu.edu.tw，繳交電子檔後再將紙本繳交至材料系辦徐小姐。

※ Both scanned copies and hard copies must be submitted. Incomplete submissions will not be recommended.

※ Please compile the electronic files into a single PDF file in the specified order.

※ The content of the scanned copies and the hard copies must be identical. Any discrepancies will be considered incomplete and will not be recommended.

封面(空白)

同學好：

歡迎報名參加 NYCU土木工程學系/工學院 3+2學碩雙聯學位座談會！
本次座談會將介紹土木系/工學院與合作學校之3+2雙聯學位申請流程、資格條件及獎學金機會，並提供同學與師長互動及提問的機會。

 Time：114年11月3日（星期一）中午12:10開始
 Location：工二館117教室
 備註：本活動提供午餐，歡迎踴躍參加！

報名網址： https://forms.gle/45X1hQnb2WC9ziB49

期待與各位同學在座談會中見面！

(1)直接錄取同學會個別寄信通知(2)初試合格及複試注意事項請參閱附件一~附件四(附件一)115 碩士班甄試入學招生 初試合格名單(甲組)(附件二)115 碩士班甄試入學招生 初試合格名單(乙組)(附件三)115碩甄 口試注意事項及口試順序公告(Attachment 4) Master's Program Admission Oral Exam Report Format Template (Please rename the file to Group Number, Candidate Number, Name) 

中華民國台灣半導體產業協會2026「TSIA半導體獎：博士研究生」與「TSIA半導體獎：具博士學位之新進研究人員」申請案

此案須排序，請於114年11月10日前將推薦名單掃描檔（需排序，如附件3）、申請資料（如附件4）合併後PDF檔送至系辦進行初審排序

獲本校推薦者，將另行通知申請人依相關規定辦理上傳資料事宜。 

附件1 來文頁面檔

附件2-1 申請辦法

附件2-2 2026 TSIA半導體獎 博士研究生 申請表

附件2-3 2026 TSIA半導體獎 博士研究生 推薦函

附件2-4 2026 TSIA半導體獎 具博士學位之新進研究人員 申請表

附件2-5 2026 TSIA半導體獎 具博士學位之新進研究人員 推薦函

附件3 推薦名單(回條)

附件4 準備申請資料

(1)本系收件日期： 10/27前送繳至系辦 (2)請參閱附件 附件1 教育部來函附件2 教育部補助大學校院學生出國參加國際性學術技藝能競賽作業要點附件3 申請表附件4 申請表填寫說明

Powerchip Semiconductor “Working Together for Success” Master’s Pre-Employment Scholarship

Applications are open from now until November 28, 2025. Students who meet the eligibility criteria are encouraged to apply.

1. The scholarship is administered in accordance with the “Powerchip Semiconductor ‘Working Together for Success’ Master’s Pre-Employment Scholarship Application Guidelines” (Attachment 1).

2. Scholarship Details: A total of 18 master’s students will be awarded. Each recipient will receive NT$300,000 per year, for up to two years.

3. Eligibility: Current master’s students in the College of Electrical and Computer Engineering, International College of Semiconductor Technology, College of Industry-Academia Innovation, College of Engineering, College of Science, College of Photonics, College of Computer Science, or College of Intelligent Science and Green Energy at this university, as well as those planning to apply for the 2026 master’s program in any of the aforementioned colleges (excluding in-service programs).

4. Application procedures and related details can be found in Attachments 1 and 2. The application deadline is November 28, 2025.

5. Contact Information:

National Yang Ming Chiao Tung University Powerchip–NYCU Research Center Ms. Tseng Tel: (03)5712121 #56092 Email: khtseng@nycu.edu.tw      
Powerchip Semiconductor Manufacturing Corporation Human Resources Department Ms. Tung Tel: (03)5795000 #2468 Email: evatung@powerchip.com

(Attachment 1) Application Guidelines – 2025 Recruitment and Scholarship Program, Powerchip–NYCU Research Center

(Attachment 2) Pre-Employment Scholarship Application Form

Application Form for “UCI 3+2 Engineering Program”

Application Form for “UCI 3+2 Engineering Program”

Scholarship Information

The College of Engineering at National Yang Ming Chiao Tung University (NYCU) has established a 3+2 Dual Degree Program with the University of California, Irvine (UCI). Through this partnership, UCI will provide one scholarship each year for the next three years to an NYCU College of Engineering student participating in the 3+2 program. This scholarship is funded by the J. Yang Scholarship Program, offering USD 28,000 per student per year to cover most of the tuition and fees for the program. For example, the current annual tuition and fees are approximately USD 34,000. With this scholarship, students will only need to pay about USD 6,000, in addition to covering their health insurance, visa fees, and living expenses independently. Please note that the scholarship is intended for undergraduate students. Therefore, in the final (fifth) year of the 3+2 program—when the student will no longer hold undergraduate status—the scholarship will no longer be available.

Required application documents:

1. Application Form
2. Official Academic Transcript in Chinese (must include cumulative GPA and class ranking)
3. TOEFL or IELTS Score Report (taken within the past two years)
4. Statement of Purpose / Motivation Letter (no specific format required)
5. Study Plan – Please specify: o How many credits you have completed so far o Which courses you will take in the second semester of your junior year o Which courses you plan to take at UC Irvine (no specific format required)

• Deadline for students: Submit all required documents to your department office by 5:00 PM, November 10. • For department coordinators: Please send the electronic files and ranking results to Ms. Daphne Chang (email: daphnechang@nycu.edu.tw) by November 17, 2025 (Monday). After submitting the electronic file, please deliver the paper copies to Ms. Ya-Chun Chang (#31292), College of Engineering Office.

※ Please compile the electronic files into a single PDF file in the specified order.

※ The content of the scanned copies and the hard copies must be identical. Any discrepancies will be considered incomplete and will not be recommended.

系辦收件日期：即日起~114.10.19 (逾期不受理)

相關訊息：

一、

二、114年博士生獎學金發放時程預計如下(追朔至114年9月1日):

1. 教育部博士生獎學金獲獎學生：114年12月31日前
2. 國科會博士生獎學金獲獎學生：115年1月31日前

三、繳交檔案

    檔案內包括:

    (1) 申請表

    (2) 勞保投保紀錄  

查詢日期起迄:114.9.1-114.10.13

網頁下載時間須為114年10月13日以後的時間。

    (3) 博士生獎學金切結書  

    (4) 114學年度第1學期之在學證明書 

    (5) 符合申請資格之佐證資料

    (6) 博士學位研究計畫

   (7) 所屬學院要求之其他項目

   檔名說明：114學年度「博士生獎學金補助計畫」申請表_學院名稱+學生姓名

   檔名範例：114學年度「博士生獎學金補助計畫」申請表_工學院林小美

    附件6.配合款出資規劃同意書(電子檔、紙本皆須繳交)

   檔名範例：配合款出資規劃同意書_工學院

附件檔案：

1)附件1.國立陽明交通大學博士生獎學金要點

2)附件2.114年國立陽明交通大學博士生獎學金申請注意事項

3)附件3.114學年度各學院國科會暨教育部博士生獎學金申請總人數統計表

4)附件4.114年博士生獎學金學生資料彙整表

5)附件5.114年博士生獎學金申請表

     附件5.114年博士生獎學金申請表

6)附件6.配合款出資規劃同意書

7)附件7.博士生獎學金切結書

8)附件8.勞保投保紀錄申請方式SOP

Pre-Graduation Program:

The program provides comprehensive training in the semiconductor industry and products, and assists participants in transitioning to the workplace. Graduates will be prepared to become Customer Support Engineers, Global Installation Engineers, or Process Engineers. Even fresh graduates can earn an annual salary of over one million TWD in their first year and secure their dream offer before graduation, gaining a head start in their careers!

Hiring opportunities: Customer Engineer / Global Installation Engineer iTeam / Process Support Engineer

Program Introduction: Pre-Graduation Recruitment Project

Eligibility: Graduating students with a Bachelor's or Master's degree in Science and Engineering fields in 2026

Application Deadline: From now until November 30th

TalentOneProgram:

TalentOne Program provides a three-year structured training program with cross-organizational rotations. Participants will also benefit from a comprehensive mentoring system and have the opportunity to visit and receive training at Applied Materials' international locations. This is a chance to step onto the global stage and become part of the organization's leadership pipeline!

Hiring opportunities:Customer Engineer / Global Installation Engineer iTeam

Program Introduction: Elite Talent Pipeline Program

Eligibility: Recent graduates (within one year) with a Bachelor's or Master's degree in Engineering or interdisciplinary fields, from domestic or international institutions.

Application Deadline: From now until November 30th

More information

【WeAreAll應】助力邁向應派菁英之路的「機不可失」線上說明會來了！

點我搶先卡位： https://bit.ly/4lppWSm

想了解客戶技術支援／全球裝機工程師的日常？想知道如何踏出科技職涯的關鍵第一步？ 應材為理工新秀打造的「機不可失」線上說明會，由前輩和主管直播暢聊職涯、解答疑問，帶你深入探索工程師的世界！

三大含金亮點，職涯情報一次掌握

▍工程師實戰直擊

從客戶溝通到技術專業，全面了解工程師工作環境與核心能力，展現職人精神!

▍企業文化零距離

透過線上互動，親身感受美商開放文化，團隊合作的默契與創新驅動的工作氛圍

▍求職攻略大公開

前輩與主管分享應材的系統培訓及成長路徑，解鎖面試必備技能與心態

加碼抽好禮

全程參與並填問卷，就有機會抽中iPad、AirPods Pro、HomePod mini 等好禮！

活動資訊

▍報名期間：即日至2025/10/19（日）

▍線上說明會：2025/10/23（四）19:00–20:30

歡迎理工背景的大學生、碩士生，以及進入 STEM職場三年內的新鮮人報名

快來加入應材行列，開啟你的科技職涯新篇章！

完成學校的115碩士班甄試報名系統程序後，請填寫考生資料表

(1)連結如下

甲組連結：https://forms.gle/QBmwZEh5HR9c3fdp8

乙組連結：https://forms.gle/YcZRBtCTy3NYJ2Na9

(2) 最後編輯時間與學校報名截止時間相同

Please refer to the attachment:

114學年度大四自我檢核表繳交說明

自我檢核(1613)114A版

自我檢核(1613)跨域○○114A版

自我檢核(1613)跨域三一114A版

109(含)前入學_自我檢核(1613)112A版

教育部新工程計畫苗圃工作坊開始報名，連結網站如下:

https://neemec.web.nycu.edu.tw/%e6%9c%80%e6%96%b0%e6%b6%88%e6%81%af/

有任何問題，歡迎來電，謝謝您!

The research team led by Assistant Professor Yen-Lin Huang from the Department of Materials Science and Engineering has successfully overcome key material limitations in spin-orbit torque magnetic random-access memory (SOT-MRAM). If this high-speed, low-power memory technology can be successfully commercialized, it is expected to benefit the development of large language models (LLMs) and AI computing, as well as mobile devices (by extending battery life and enhancing data security) and automotive electronics and data centers (by improving reliability and reducing energy consumption). This achievement has been published in Nature Electronics, showcasing Taiwan’s innovative capabilities in next-generation memory technologies.

2025 First Session – Student Outstanding Research Achievement Award Applications are now open and will be accepted until Monday, October 13, 2025. Late submissions will not be accepted.

1. The Office of Research and Development has, on September 18, 2025, issued an official letter (Document No. 1140040557, Attachment 1) under the reference " 1140040557", to inform all colleges of the university that applications for the First Session of the 2025 Student Outstanding Research Achievement Award are now open for research outcomes derived from student projects completed in 2025.

2. Interested applicants are advised to refer to the award guidelines and application instructions provided in the attachments. Please submit your application in accordance with the deadlines set by your respective department or college. Late submissions will not be accepted.

(1) Eligibility Period for Accepted Research Outcomes: Research outcomes completed during the year 2025 (January 1, 2025 to December 31, 2025) will be considered.

(2) Eligibility Criteria: Eligibility must comply with Articles 3, 4, and 5 of the "National Yang Ming Chiao Tung University Guidelines for the Student Outstanding Research Achievement Award" (see Attachments 1-2).

(3) Application Procedure:

1. 1. 1. Complete the Application Form and Prepare Supporting Documents Applicants (students) must complete the "2025 Student Outstanding Research Achievement Award Application Form" (Attachment 2), obtain handwritten or electronic signatures from both the applicant and their faculty advisor, and attach all relevant supporting documents. The complete application must then be submitted to the applicant's department or college for initial eligibility review.
      2. Department/College Initial Review Departmental staff should assist in confirming that the submitted research outcome qualifies under one of the following criteria: • The award was received during the student’s enrollment and under NYCU affiliation, or • The journal article was submitted during enrollment and accepted or published within the 2025 calendar year.
      3. Submission to the Office of R&D College staff are requested to consolidate all applications that have passed the eligibility review within the college. Hard copies (along with all digital files) of the approved applications should then be submitted in batch to the designated contact windows of Planning Division I or II, Office of Research and Development, for further university-level review and evaluation.

(4) Required Application Documents: Applicants (students) must submit both hard copies and electronic files of the following documents no later than Monday, October 13, 2025, to Ms. Hsu at the departmental office (Email: betty0422@nycu.edu.tw). Late submissions will not be accepted.

Please ensure timely submission to facilitate processing.

[Attachment 1-1] Important Notes for the First Application Round of 2025

[Attachment 1-2] Guidelines for the Student Outstanding Research Achievement Award, National Yang Ming Chiao Tung University

【附件2】 申請表 (中文版)

【Appendix 2】 Application Form (English Version)

[Attachment 3] Team Member Information and Contribution Statement

[Attachment 4] WOS Database Paper Retrieval Procedure and Supporting Document Template

[Attachment 5] JCR Database Journal IF Value and JIF Percentile Retrieval Procedure and Supporting Document Template

[Attachment 6] Form C – Instructions for Completing the Journal Publication Type Form