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115學年度材料科學與工程學系博士甄試錄取生報到通知

研究所新生報到資料表115

碩、博指導教授志願書115

Dear Student:

To assist students interested in pursuing graduate studies in the United States with more information on further education, our school has specially invited representatives from Purdue University to hold a master's degree information session on campus, introducing the university's graduate programs,admission application process, scholarship opportunities, and resources for international student development.

Session details are as follows:
 Date:November 13 (Thu)
 Time: 10:30-11:30
 Location: Engineering building 5 room 322B

his event will be personally presented by the Purdue University representatives, with on-site Q&A for students' questions.Students interested in overseas graduate school applications or Purdue University's programs are warmly welcome to participate actively.

Ph.D. student Hsu, Wei-Hsiang from Prof. Chung Tsai-Fu’s lab participated in the 2025 3rd International Conference on Materials Science, Engineering and Technology (MSET 2025) and presented his research titled "Mechanical Property and Microstructure Evolution of Recycled 7000-Series Aluminum Alloys." His presentation was awarded Best Oral Presentation. (In the photo: conference chair on the right; Hsu, Wei-Hsiang on the left.) Ph.D. student Chen, Kuan-Ting from Prof. Chung Tsai-Fu’s lab took part in the 2025 3rd International Conference on Materials Science, Engineering and Technology (MEST 2025) and presented his research titled "Tailoring Strength and Structure: Double-Step Tempered Cr/Ni-Rich Medium Carbon Steel under Different Strain Rate Loadings." He also received the Best Oral Presentation award.

UIUC-NYCU MSE (3+2) 2026 Fall semester 開始申請!

Required application documents:
1. Cover Page

2. Official Academic Transcript in Chinese (must include cumulative GPA and class ranking)
   3. TOEFL or IELTS Scores (within the last two years)
   4. Statement of Purpose (no specific format required)
   5. Study Plan (How many credits have been completed so far? What courses will be completed in the second semester of your junior year? Which courses will be taken at UIUC?) (no specific format required)

欲申請的同學請於114年11月20日(四)下午4點前將以上文件電子檔寄至chhsu0909@nycu.edu.tw，繳交電子檔後再將紙本繳交至材料系辦徐小姐。

※ Both scanned copies and hard copies must be submitted. Incomplete submissions will not be recommended.

※ Please compile the electronic files into a single PDF file in the specified order.

※ The content of the scanned copies and the hard copies must be identical. Any discrepancies will be considered incomplete and will not be recommended.

封面(空白)

同學好：

歡迎報名參加 NYCU土木工程學系/工學院 3+2學碩雙聯學位座談會！
本次座談會將介紹土木系/工學院與合作學校之3+2雙聯學位申請流程、資格條件及獎學金機會，並提供同學與師長互動及提問的機會。

 Time：114年11月3日（星期一）中午12:10開始
 Location：工二館117教室
 備註：本活動提供午餐，歡迎踴躍參加！

報名網址： https://forms.gle/45X1hQnb2WC9ziB49

期待與各位同學在座談會中見面！

(1)直接錄取同學會個別寄信通知(2)初試合格及複試注意事項請參閱附件一~附件四(附件一)115 碩士班甄試入學招生 初試合格名單(甲組)(附件二)115 碩士班甄試入學招生 初試合格名單(乙組)(附件三)115碩甄 口試注意事項及口試順序公告(Attachment 4) Master's Program Admission Oral Exam Report Format Template (Please rename the file to Group Number, Candidate Number, Name) 

中華民國台灣半導體產業協會2026「TSIA半導體獎：博士研究生」與「TSIA半導體獎：具博士學位之新進研究人員」申請案

此案須排序，請於114年11月10日前將推薦名單掃描檔（需排序，如附件3）、申請資料（如附件4）合併後PDF檔送至系辦進行初審排序

獲本校推薦者，將另行通知申請人依相關規定辦理上傳資料事宜。 

附件1 來文頁面檔

附件2-1 申請辦法

附件2-2 2026 TSIA半導體獎 博士研究生 申請表

附件2-3 2026 TSIA半導體獎 博士研究生 推薦函

附件2-4 2026 TSIA半導體獎 具博士學位之新進研究人員 申請表

附件2-5 2026 TSIA半導體獎 具博士學位之新進研究人員 推薦函

附件3 推薦名單(回條)

附件4 準備申請資料

(1)本系收件日期： 10/27前送繳至系辦 (2)請參閱附件 附件1 教育部來函附件2 教育部補助大學校院學生出國參加國際性學術技藝能競賽作業要點附件3 申請表附件4 申請表填寫說明

Powerchip Semiconductor “Working Together for Success” Master’s Pre-Employment Scholarship

Applications are open from now until November 28, 2025. Students who meet the eligibility criteria are encouraged to apply.

1. The scholarship is administered in accordance with the “Powerchip Semiconductor ‘Working Together for Success’ Master’s Pre-Employment Scholarship Application Guidelines” (Attachment 1).

2. Scholarship Details: A total of 18 master’s students will be awarded. Each recipient will receive NT$300,000 per year, for up to two years.

3. Eligibility: Current master’s students in the College of Electrical and Computer Engineering, International College of Semiconductor Technology, College of Industry-Academia Innovation, College of Engineering, College of Science, College of Photonics, College of Computer Science, or College of Intelligent Science and Green Energy at this university, as well as those planning to apply for the 2026 master’s program in any of the aforementioned colleges (excluding in-service programs).

4. Application procedures and related details can be found in Attachments 1 and 2. The application deadline is November 28, 2025.

5. Contact Information:

National Yang Ming Chiao Tung University Powerchip–NYCU Research Center Ms. Tseng Tel: (03)5712121 #56092 Email: khtseng@nycu.edu.tw      
Powerchip Semiconductor Manufacturing Corporation Human Resources Department Ms. Tung Tel: (03)5795000 #2468 Email: evatung@powerchip.com

(Attachment 1) Application Guidelines – 2025 Recruitment and Scholarship Program, Powerchip–NYCU Research Center

(Attachment 2) Pre-Employment Scholarship Application Form

Application Form for “UCI 3+2 Engineering Program”

Application Form for “UCI 3+2 Engineering Program”

Scholarship Information

The College of Engineering at National Yang Ming Chiao Tung University (NYCU) has established a 3+2 Dual Degree Program with the University of California, Irvine (UCI). Through this partnership, UCI will provide one scholarship each year for the next three years to an NYCU College of Engineering student participating in the 3+2 program. This scholarship is funded by the J. Yang Scholarship Program, offering USD 28,000 per student per year to cover most of the tuition and fees for the program. For example, the current annual tuition and fees are approximately USD 34,000. With this scholarship, students will only need to pay about USD 6,000, in addition to covering their health insurance, visa fees, and living expenses independently. Please note that the scholarship is intended for undergraduate students. Therefore, in the final (fifth) year of the 3+2 program—when the student will no longer hold undergraduate status—the scholarship will no longer be available.

Required application documents:

1. Application Form
2. Official Academic Transcript in Chinese (must include cumulative GPA and class ranking)
3. TOEFL or IELTS Score Report (taken within the past two years)
4. Statement of Purpose / Motivation Letter (no specific format required)
5. Study Plan – Please specify: o How many credits you have completed so far o Which courses you will take in the second semester of your junior year o Which courses you plan to take at UC Irvine (no specific format required)

• Deadline for students: Submit all required documents to your department office by 5:00 PM, November 10. • For department coordinators: Please send the electronic files and ranking results to Ms. Daphne Chang (email: daphnechang@nycu.edu.tw) by November 17, 2025 (Monday). After submitting the electronic file, please deliver the paper copies to Ms. Ya-Chun Chang (#31292), College of Engineering Office.

※ Please compile the electronic files into a single PDF file in the specified order.

※ The content of the scanned copies and the hard copies must be identical. Any discrepancies will be considered incomplete and will not be recommended.

系辦收件日期：即日起~114.10.19 (逾期不受理)

相關訊息：

一、

二、114年博士生獎學金發放時程預計如下(追朔至114年9月1日):

1. 教育部博士生獎學金獲獎學生：114年12月31日前
2. 國科會博士生獎學金獲獎學生：115年1月31日前

三、繳交檔案

    檔案內包括:

    (1) 申請表

    (2) 勞保投保紀錄  

查詢日期起迄:114.9.1-114.10.13

網頁下載時間須為114年10月13日以後的時間。

    (3) 博士生獎學金切結書  

    (4) 114學年度第1學期之在學證明書 

    (5) 符合申請資格之佐證資料

    (6) 博士學位研究計畫

   (7) 所屬學院要求之其他項目

   檔名說明：114學年度「博士生獎學金補助計畫」申請表_學院名稱+學生姓名

   檔名範例：114學年度「博士生獎學金補助計畫」申請表_工學院林小美

    附件6.配合款出資規劃同意書(電子檔、紙本皆須繳交)

   檔名範例：配合款出資規劃同意書_工學院

附件檔案：

1)附件1.國立陽明交通大學博士生獎學金要點

2)附件2.114年國立陽明交通大學博士生獎學金申請注意事項

3)附件3.114學年度各學院國科會暨教育部博士生獎學金申請總人數統計表

4)附件4.114年博士生獎學金學生資料彙整表

5)附件5.114年博士生獎學金申請表

     附件5.114年博士生獎學金申請表

6)附件6.配合款出資規劃同意書

7)附件7.博士生獎學金切結書

8)附件8.勞保投保紀錄申請方式SOP

Pre-Graduation Program:

The program provides comprehensive training in the semiconductor industry and products, and assists participants in transitioning to the workplace. Graduates will be prepared to become Customer Support Engineers, Global Installation Engineers, or Process Engineers. Even fresh graduates can earn an annual salary of over one million TWD in their first year and secure their dream offer before graduation, gaining a head start in their careers!

Hiring opportunities: Customer Engineer / Global Installation Engineer iTeam / Process Support Engineer

Program Introduction: Pre-Graduation Recruitment Project

Eligibility: Graduating students with a Bachelor's or Master's degree in Science and Engineering fields in 2026

Application Deadline: From now until November 30th

TalentOneProgram:

TalentOne Program provides a three-year structured training program with cross-organizational rotations. Participants will also benefit from a comprehensive mentoring system and have the opportunity to visit and receive training at Applied Materials' international locations. This is a chance to step onto the global stage and become part of the organization's leadership pipeline!

Hiring opportunities:Customer Engineer / Global Installation Engineer iTeam

Program Introduction: Elite Talent Pipeline Program

Eligibility: Recent graduates (within one year) with a Bachelor's or Master's degree in Engineering or interdisciplinary fields, from domestic or international institutions.

Application Deadline: From now until November 30th

More information

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點我搶先卡位： https://bit.ly/4lppWSm

想了解客戶技術支援／全球裝機工程師的日常？想知道如何踏出科技職涯的關鍵第一步？ 應材為理工新秀打造的「機不可失」線上說明會，由前輩和主管直播暢聊職涯、解答疑問，帶你深入探索工程師的世界！

三大含金亮點，職涯情報一次掌握

▍工程師實戰直擊

從客戶溝通到技術專業，全面了解工程師工作環境與核心能力，展現職人精神!

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透過線上互動，親身感受美商開放文化，團隊合作的默契與創新驅動的工作氛圍

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活動資訊

▍報名期間：即日至2025/10/19（日）

▍線上說明會：2025/10/23（四）19:00–20:30

歡迎理工背景的大學生、碩士生，以及進入 STEM職場三年內的新鮮人報名

快來加入應材行列，開啟你的科技職涯新篇章！

完成學校的115碩士班甄試報名系統程序後，請填寫考生資料表

(1)連結如下

甲組連結：https://forms.gle/QBmwZEh5HR9c3fdp8

乙組連結：https://forms.gle/YcZRBtCTy3NYJ2Na9

(2) 最後編輯時間與學校報名截止時間相同

Please refer to the attachment:

114學年度大四自我檢核表繳交說明

自我檢核(1613)114A版

自我檢核(1613)跨域○○114A版

自我檢核(1613)跨域三一114A版

109(含)前入學_自我檢核(1613)112A版