2026聯電海內外暑期實習菁英計畫正式招募!
●全球視野：不僅僅是台灣，我們還有海外新加坡廠的實習機會，讓你在國際舞台上發光發熱！
●專業技術：加入UMC，你將有機會接觸到最專業的半導體技術，與業界專家一起工作，學習最實用的技能！
●專人指導：專職指導者及HR全程陪伴，提供最全面的指導和支持，讓你在實習期間快速成長！
●職涯發展：這不僅僅是一個實習機會，更是你職涯發展的跳板！表現優異者還有機會獲得正式聘用！

立刻申請【2026聯電海內外暑期實習菁英計畫】體驗半導體業的職場生活！

●申請資格
電機、電子、物理、化學、化工、材料、光電、資工、統計等理工系所大四(含)以上在學生(含碩博)。

●實習職務
技術研發(元件設計/先進封裝/研發製程整合/模組製程) / 12"製程整合 / 製程 / 智慧製造 / 資訊 / 數據分析等

●實習地點
 聯華電子 台灣廠(竹科 / 南科) 或 新加坡廠

●實習福利
除實習月薪外，台灣廠區提供餐費補助及免費宿舍，新加坡廠區吃住全免，未來轉正更可享有簽約金！

立即點選報名網址投遞履歷  https://careers.umc.com/plan.php?mid=115

*請於自傳中說明論文或專題研究方向；預碩生請於學歷欄位註明碩士學歷*

Please refer to the attachment:

Recommendation Letter for Direct Admission to PhD Program (Bachelor's and Master's Students)

學生逕修讀博士學位作業 (1142)

1.來文頁面檔
2.2026總統教育獎遴選分組實施計畫

由於114學年度第二學期工學院並未開設「工程數學(二)」，故本系必修「工程數學(二)」相關規定仍與往年相同由本系自行開課，請本系同學修習材料系開的「工程數學(二)」(永久課號：ENMS10006)，若修習外系課程，將不予採計為大學畢業學分。

(1)備取公告請參閱附件

(2)相關文件下載：https://drive.google.com/drive/folders/1620PVV4Baxj2isKsOFTdhSHNZ7LBhueI

115碩甄-第1梯次備取(114.12.2通知)

Required application documents:
1. Cover Page

2. Official Academic Transcript in Chinese (must include cumulative GPA and class ranking)
   3. TOEFL or IELTS Scores (within the last two years)
   4. Statement of Purpose (no specific format required)
   5. Study Plan (How many credits have been completed so far? What courses will be completed in the second semester of your junior year? Which courses will be taken at UIUC?) (no specific format required)

欲申請的同學請於114年12月16日(二)下午4點前將以上文件電子檔寄至chhsu0909@nycu.edu.tw，繳交電子檔後再將紙本繳交至材料系辦徐小姐。

※ Both scanned copies and hard copies must be submitted. Incomplete submissions will not be recommended.

※ Please compile the electronic files into a single PDF file in the specified order.

※ The content of the scanned copies and the hard copies must be identical. Any discrepancies will be considered incomplete and will not be recommended.

封面(空白)

伊朗文化交流分享會

為了促進校園多元文化交流，認識不同文化背景的同學們，很高興本次邀請到工學院伊朗籍的同學們跟大家一起分享伊朗的文化特色，藉此機會開啟不同的文化體驗及對話，為了讓我們能統計人數，若有興趣的同學一定要填寫喔，謝謝！

活動日期:11/28(五)

活動時間:中午12:00-13:20

Location: Engineering Building 5, Room 322B

International Day Event at the College of Engineering, NYCU

Join us for lunch and cultural exchange!
This event is open to all students in the College of Engineering.
Senior international students will be hosting this event, sharing their experiences, answering questions about university life, and promote a sense of community among new students.
It’s a great opportunity to meet new people and enjoy a delightful meal together!
[Highlights:]
· Learn about different cultures
· Open Q&A session
· Fun interactive activities and networking
· Free lunch provided
International Day: College of Engineering NYCU
· Date: November 28th, 2025
· Time: 12:00 PM – 1:20 PM
· Location: Engineering Building 5, Room 322B

說明：
(1) 相關文件請參閱附件
(2) 本次報到對象為：直接錄取生、正取生
(備取生會依正取生報到狀況後續再公告、聯繫)
(3)指導教授若尚未確定，可不必於報到當天繳交指導教授志願書
研究所新生報到資料表115
切結書
二月入學申請書及學位證書切結書
放棄聲明書
115學年度材料科學與工程學系碩士甄試錄取生(直接錄取、正取)報到通知
碩、博指導教授志願書115
115碩甄老師組別 (甲、乙)

請參閱附件

115學年度材料科學與工程學系博士甄試錄取生報到通知

研究所新生報到資料表115

碩、博指導教授志願書115

Dear Student:

To assist students interested in pursuing graduate studies in the United States with more information on further education, our school has specially invited representatives from Purdue University to hold a master's degree information session on campus, introducing the university's graduate programs,admission application process, scholarship opportunities, and resources for international student development.

Session details are as follows:
 Date:November 13 (Thu)
 Time: 10:30-11:30
 Location: Engineering building 5 room 322B

his event will be personally presented by the Purdue University representatives, with on-site Q&A for students' questions.Students interested in overseas graduate school applications or Purdue University's programs are warmly welcome to participate actively.

Ph.D. student Hsu, Wei-Hsiang from Prof. Chung Tsai-Fu’s lab participated in the 2025 3rd International Conference on Materials Science, Engineering and Technology (MSET 2025) and presented his research titled "Mechanical Property and Microstructure Evolution of Recycled 7000-Series Aluminum Alloys." His presentation was awarded Best Oral Presentation. (In the photo: conference chair on the right; Hsu, Wei-Hsiang on the left.) Ph.D. student Chen, Kuan-Ting from Prof. Chung Tsai-Fu’s lab took part in the 2025 3rd International Conference on Materials Science, Engineering and Technology (MEST 2025) and presented his research titled "Tailoring Strength and Structure: Double-Step Tempered Cr/Ni-Rich Medium Carbon Steel under Different Strain Rate Loadings." He also received the Best Oral Presentation award.

UIUC-NYCU MSE (3+2) 2026 Fall semester 開始申請!

Required application documents:
1. Cover Page

2. Official Academic Transcript in Chinese (must include cumulative GPA and class ranking)
   3. TOEFL or IELTS Scores (within the last two years)
   4. Statement of Purpose (no specific format required)
   5. Study Plan (How many credits have been completed so far? What courses will be completed in the second semester of your junior year? Which courses will be taken at UIUC?) (no specific format required)

欲申請的同學請於114年11月20日(四)下午4點前將以上文件電子檔寄至chhsu0909@nycu.edu.tw，繳交電子檔後再將紙本繳交至材料系辦徐小姐。

※ Both scanned copies and hard copies must be submitted. Incomplete submissions will not be recommended.

※ Please compile the electronic files into a single PDF file in the specified order.

※ The content of the scanned copies and the hard copies must be identical. Any discrepancies will be considered incomplete and will not be recommended.

封面(空白)

同學好：

歡迎報名參加 NYCU土木工程學系/工學院 3+2學碩雙聯學位座談會！
本次座談會將介紹土木系/工學院與合作學校之3+2雙聯學位申請流程、資格條件及獎學金機會，並提供同學與師長互動及提問的機會。

 Time：114年11月3日（星期一）中午12:10開始
 Location：工二館117教室
 備註：本活動提供午餐，歡迎踴躍參加！

報名網址： https://forms.gle/45X1hQnb2WC9ziB49

期待與各位同學在座談會中見面！

(1)直接錄取同學會個別寄信通知(2)初試合格及複試注意事項請參閱附件一~附件四(附件一)115 碩士班甄試入學招生 初試合格名單(甲組)(附件二)115 碩士班甄試入學招生 初試合格名單(乙組)(附件三)115碩甄 口試注意事項及口試順序公告(Attachment 4) Master's Program Admission Oral Exam Report Format Template (Please rename the file to Group Number, Candidate Number, Name) 

中華民國台灣半導體產業協會2026「TSIA半導體獎：博士研究生」與「TSIA半導體獎：具博士學位之新進研究人員」申請案

此案須排序，請於114年11月10日前將推薦名單掃描檔（需排序，如附件3）、申請資料（如附件4）合併後PDF檔送至系辦進行初審排序

獲本校推薦者，將另行通知申請人依相關規定辦理上傳資料事宜。 

附件1 來文頁面檔

附件2-1 申請辦法

附件2-2 2026 TSIA半導體獎 博士研究生 申請表

附件2-3 2026 TSIA半導體獎 博士研究生 推薦函

附件2-4 2026 TSIA半導體獎 具博士學位之新進研究人員 申請表

附件2-5 2026 TSIA半導體獎 具博士學位之新進研究人員 推薦函

附件3 推薦名單(回條)

附件4 準備申請資料