Education:
University of California Los Angeles UCLA Department of Materials Science and Engineering Ph.D.
University of California Los Angeles UCLA Department of Materials Science and Engineering M.S.
National Tsing Hua University Department of Materials Science and Engineering B.S.
Experience:
August 2012 – January 2017 National Chiao Tung University Department of Materials Science and Engineering Distinguished Professor & Director Nanotechnology Undergraduate Program
February 2013 – January 2020 National Chiao Tung University Graduate Institute of Materials Science and Engineering Distinguished Professor
August 2007 – Present National Chiao Tung University Graduate Institute of Materials Science and Engineering Professor
August 2004 – July 2007 National Chiao Tung University Graduate Institute of Materials Science and Engineering Associate Professor
August 2000 – July 2004 National Chiao Tung University Graduate Institute of Materials Science and Engineering Assistant Professor
January 2000 – April 2000 University of California Los Angeles Lecturer Materials Science and Engineering
June 1999 – July 2000 University of California Los Angeles Postdoctoral Researcher Materials Science and Engineering
Honors and Awards:
2007 National Chiao Tung University Outstanding Teaching Award
2007 Wu Ta-You Memorial Award
2012 Academia Sinica Young Scholar Research Publication Award
2012 National Chiao Tung University Outstanding Teaching Award
2012 Excellent Young Scholar Research Project Ministry of Science and Technology
2015 National Chiao Tung University Outstanding Teaching Award
2015 National Chiao Tung University Honorary Teaching Faculty
2016 13th National Innovation Award Academic Research Innovation Award Chemical Engineering and Materials Category
2016 National Chiao Tung University Industry-Academia Technology Exchange Excellence Contribution Bronze Feather Award and Special Contribution Award
2016 Chinese Materials Society 1st Materials Innovation Award First Place
2018 Application to Practice Award TMS (The Minerals Metals & Materials Society)
Research Fields
Electromigration and metallurgical reactions in flip-chip solder joints
3D IC packaging
Nanotwinned Cu: fabrication and application
Low-temperature Cu-to-Cu direct bonding
Industry-Academia Collaboration Areas
Electromigration and metallurgical reactions in flip-chip solder joints
3D IC packaging
Nanotwinned Cu: fabrication and application
Low-temperature Cu-to-Cu direct bonding