Jihperng Leu
Professor
Contact Information:
Office Phone: 03-5712121-31420
Fax: 03-5724727
Office: Room 316, Engineering Building 6
E-mail: jimleu@nycu.edu.tw
Laboratory Extension: 03-5712121-55326
Laboratory Website: https://140.113.226.137/nip/index.php
Education:
University of Minnesota, Twin Cities USA Chemical Engineering Ph.D 1990年畢業
University of Florida USA Chemical Engineering Master 1984年畢業
國立清華大學 化學工程系學士 1980年畢業
Experience:
國立交通大學材料系教授
Intel Corp. Components Research Manager 1997年 ~ 2004年
Motorola Inc. Semiconductor Products Sector Sr. Staff Engineer 1994年 ~ 1997年
University of Texas at Austin Materials Science and Engineering Research Associate 1991-1994年
IBM Corp T.J. Watson Research Center Visiting Scientist 1990年 ~ 1991年
國立清華大學化學工程所研究助理 1983年
Research Fields
Semiconductor fabrication and integration
Low-k dielectric materials
Nanomaterials and thin film materials
Research on novel low-k dielectric materials
Packaging applications of OLED and flexible transistors
Application of novel underfill materials in packaging processes
Die/Packaging interaction and thermo-mechanical behavior in Cu/Low-k interconnects
Thermoelectric materials