陳智-國立陽明交通大學材料科學與工程學系所

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陳智

成員介紹學術研究學術著作

職稱
講座教授

聯絡方式
辦公室電話：03-5712121-31814
傳真：03-5724727
辦公室：工程六館 310
e-mail：chihchen@nycu.edu.tw
實驗室分機：03-5712121-55377

實驗室網站
https://cclab.web.nycu.edu.tw/

學歷
- 美國加州大學洛杉磯分校UCLA材料系博士 1999年畢業
- 美國加州大學洛杉磯分校UCLA材料系碩士
- 國立台灣清華大學材料科學與工程學系學士
經歷
- 國立交通大學材料系特聘教授兼系主任(2017.02-2023.01)
- 國立交通大學材料系特聘教授兼奈米學士班主任(2012.08-2017.01)
- 國立交通大學教授材料科學與工程研究所教授 2007年08月 ~ 迄今
- 國立交通大學材料科學與工程研究所副教授 2004年08月 ~ 2007年07月
- 國立交通大學材料科學與工程研究所助理教授 2000年08月 ~ 2004年07月
- University of California, Los Angeles Lecturer Materials Science and Engineering 2000年01月 ~ 2000年04月
- University of California, Los Angeles Post Doc Materials Science and Engineering 1999年06月 ~ 2000年07月
榮譽事蹟
- 2007年交通大學傑出教學獎
- 國科會2007年度吳大猷先生紀念獎（年輕優秀學者獎）
- 2012年中研院年輕學者研究著作獎
- 2012年交通大學傑出教學獎
- 科技部101年度年輕優秀計畫
- 2015年度交通大學傑出教學獎
- 2015年度「交通大學榮譽教學教師」
- 2016「第十三屆國家新創獎－學研新創獎」(化工與材料類)
- 2016交大產學技術交流卓越貢獻獎銅羽獎及特別貢獻獎
- 2016中國材料學會第一屆材料創新獎第一名。
- 交通大學特聘教授(2/1/2013-1/31/2016; 2/1/2017-1/31/2020)
- 2018 美國TMS(The Minerals, Metals & Materials Society)的Application to Practice Award
資料更新負責人：李佳容
研究領域
- 覆晶銲錫電遷移與冶金反應(Electromigration and metallurgical reactions in flip-chip solder joints)
- 三維積體電路封裝(3D IC packaging)
- 奈米雙晶銅的製備與應用(Nanotwinned Cu: fabrication and application)
- 低溫銅-銅直接接合(Low temperature Cu-to-Cu direct bonding)
建教合作領域
- 覆晶銲錫電遷移與冶金反應(Electromigration and metallurgical reactions in flip-chip solder joints)
- 三維積體電路封裝(3D IC packaging)
- 奈米雙晶銅的製備與應用(Nanotwinned Cu: fabrication and application)
- 低溫銅-銅直接接合(Low temperature Cu-to-Cu direct bonding)
- Eliminate Kirkendall voids in solder reactions on nanotwinned copper
  "Eliminate Kirkendall voids in solder reactions on nanotwinned copper", Tao-Chi Liu, Chien-Min Liu, Yi-Sa Huang, Chih Chen, and King-Ning Tu, Scripta Materials, 18, 241-244 (2013).
- Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging
  "Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging", Tao-Chi Liu, Yi-Sa Huang, and Chih Chen, ECS Solid State Letters, 2(2) P15-P18 (2013).
- Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
  "Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps", Y.W. Chang, H.Y. Peng, R.W. Yang, Chih Chen, T.C. Chang, C.J. Zhan, J.Y. Juang, Annie T. Huang, Microelectronics Reliability, 53, 41–46 (2013).
- Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
  "Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy", K.N. Tu, Hsiang-Yao Hsiao, Chih Chen, Microelectronics Reliability, 53, 2–6 (2013).
- Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
  "Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints", Y.C. Liang, H.W. Lin, H.P. Chen, C. Chen, K.N. Tu and Y.S.Lai, Scripta Materialia, 69, 25–28 (2013).
- Effect of Geometric Nanostructures on the Absorption Edges of 1-D and 2-D TiO2 Fabricated by Atomic Layer Deposition
  "Effect of Geometric Nanostructures on the Absorption Edges of 1-D and 2-D TiO2 Fabricated by Atomic Layer Deposition", Yung-Huang Chang, Chien-Min Liu, Hsyi-En Cheng, and Chih Chen, ACS Appl. Mater. Interfaces, 5, 3549−3555 (2013).
- Microstructure control of uni-directional growth of η-Cu6Sn5 in microbumps on <111> oriented and nanotwinned Cu
  "Microstructure control of uni-directional growth of η-Cu6Sn5 in microbumps on <111> oriented and nanotwinned Cu", Han-wen Lin, Jia-ling Lu, Chien-min Liu, Chih Chen, Delphic Chen, Jui-Chao Kuo, and K. N. Tu, Acta Materialia, 61, 4910–4919 (2013).
- Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis
  "Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis", C. K. Lin, Wei An Tsao, Y. C. Liang, and Chih Chen, J. Appl. Phys., 114, 113711-1-113711-7 (2013).
- Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints
  "Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints", C. K. Lin, Yuan Wei Chang, and Chih Chen, J. Appl. Phys., 115, 083707-1-083707-6 (2014).
- Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces, Scripta Materials
  "Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces, Scripta Materials", Chien-Min Liu, Han-wen Lin, Yi-Cheng Chu, Chih Chen*, Dian-Rong Lyu, Kuan-Neng Chen and K.N. Tu, Scripta Materials, 78-79, 65-68 (2014).