- 吳文偉
- 韋光華
- 陳三元
- 張立
- 張翼
- 吳耀銓
- 林宏洲
- 陳智
- 柯富祥
- 吳樸偉
- 徐雍鎣
- 陳軍華
- 劉典謨
- 曾院介
- 林欣杰
- 黃爾文
- 鄒年棣
- 王誠佑
- 黃彥霖
- 鍾采甫
- 林御專
- 朱英豪
- 曽根 正人
- 朝春光
- 林健正
- 呂志鵬
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Eliminate Kirkendall voids in solder reactions on nanotwinned copper
"Eliminate Kirkendall voids in solder reactions on nanotwinned copper", Tao-Chi Liu, Chien-Min Liu, Yi-Sa Huang, Chih Chen, and King-Ning Tu, Scripta Materials, 18, 241-244 (2013).
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Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging
"Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging", Tao-Chi Liu, Yi-Sa Huang, and Chih Chen, ECS Solid State Letters, 2(2) P15-P18 (2013).
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Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
"Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps", Y.W. Chang, H.Y. Peng, R.W. Yang, Chih Chen, T.C. Chang, C.J. Zhan, J.Y. Juang, Annie T. Huang, Microelectronics Reliability, 53, 41–46 (2013).
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Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
"Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy", K.N. Tu, Hsiang-Yao Hsiao, Chih Chen, Microelectronics Reliability, 53, 2–6 (2013).
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Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
"Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints", Y.C. Liang, H.W. Lin, H.P. Chen, C. Chen, K.N. Tu and Y.S.Lai, Scripta Materialia, 69, 25–28 (2013).
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Effect of Geometric Nanostructures on the Absorption Edges of 1-D and 2-D TiO2 Fabricated by Atomic Layer Deposition
"Effect of Geometric Nanostructures on the Absorption Edges of 1-D and 2-D TiO2 Fabricated by Atomic Layer Deposition", Yung-Huang Chang, Chien-Min Liu, Hsyi-En Cheng, and Chih Chen, ACS Appl. Mater. Interfaces, 5, 3549−3555 (2013).
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Microstructure control of uni-directional growth of η-Cu6Sn5 in microbumps on <111> oriented and nanotwinned Cu
"Microstructure control of uni-directional growth of η-Cu6Sn5 in microbumps on <111> oriented and nanotwinned Cu", Han-wen Lin, Jia-ling Lu, Chien-min Liu, Chih Chen, Delphic Chen, Jui-Chao Kuo, and K. N. Tu, Acta Materialia, 61, 4910–4919 (2013).
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Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis
"Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis", C. K. Lin, Wei An Tsao, Y. C. Liang, and Chih Chen, J. Appl. Phys., 114, 113711-1-113711-7 (2013).
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Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints
"Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints", C. K. Lin, Yuan Wei Chang, and Chih Chen, J. Appl. Phys., 115, 083707-1-083707-6 (2014).
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Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces, Scripta Materials
"Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces, Scripta Materials", Chien-Min Liu, Han-wen Lin, Yi-Cheng Chu, Chih Chen*, Dian-Rong Lyu, Kuan-Neng Chen and K.N. Tu, Scripta Materials, 78-79, 65-68 (2014).