學術成果-國立陽明交通大學材料科學與工程學系所

Achievements/學術成果

>Achievements

學術著作

Eliminate Kirkendall voids in solder reactions on nanotwinned copper
"Eliminate Kirkendall voids in solder reactions on nanotwinned copper", Tao-Chi Liu, Chien-Min Liu, Yi-Sa Huang, Chih Chen, and King-Ning Tu, Scripta Materials, 18, 241-244 (2013).
Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging
"Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging", Tao-Chi Liu, Yi-Sa Huang, and Chih Chen, ECS Solid State Letters, 2(2) P15-P18 (2013).
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
"Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps", Y.W. Chang, H.Y. Peng, R.W. Yang, Chih Chen, T.C. Chang, C.J. Zhan, J.Y. Juang, Annie T. Huang, Microelectronics Reliability, 53, 41–46 (2013).
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
"Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy", K.N. Tu, Hsiang-Yao Hsiao, Chih Chen, Microelectronics Reliability, 53, 2–6 (2013).
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
"Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints", Y.C. Liang, H.W. Lin, H.P. Chen, C. Chen, K.N. Tu and Y.S.Lai, Scripta Materialia, 69, 25–28 (2013).
Effect of Geometric Nanostructures on the Absorption Edges of 1-D and 2-D TiO2 Fabricated by Atomic Layer Deposition
"Effect of Geometric Nanostructures on the Absorption Edges of 1-D and 2-D TiO2 Fabricated by Atomic Layer Deposition", Yung-Huang Chang, Chien-Min Liu, Hsyi-En Cheng, and Chih Chen, ACS Appl. Mater. Interfaces, 5, 3549−3555 (2013).
Microstructure control of uni-directional growth of η-Cu6Sn5 in microbumps on <111> oriented and nanotwinned Cu
"Microstructure control of uni-directional growth of η-Cu6Sn5 in microbumps on <111> oriented and nanotwinned Cu", Han-wen Lin, Jia-ling Lu, Chien-min Liu, Chih Chen, Delphic Chen, Jui-Chao Kuo, and K. N. Tu, Acta Materialia, 61, 4910–4919 (2013).
Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis
"Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis", C. K. Lin, Wei An Tsao, Y. C. Liang, and Chih Chen, J. Appl. Phys., 114, 113711-1-113711-7 (2013).
Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints
"Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints", C. K. Lin, Yuan Wei Chang, and Chih Chen, J. Appl. Phys., 115, 083707-1-083707-6 (2014).
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces, Scripta Materials
"Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces, Scripta Materials", Chien-Min Liu, Han-wen Lin, Yi-Cheng Chu, Chih Chen*, Dian-Rong Lyu, Kuan-Neng Chen and K.N. Tu, Scripta Materials, 78-79, 65-68 (2014).