Research Area
Characteristic of the Department of Material Science and Engineering of National Chao Tung University
There are many different types of materials in this world, however they can be roughly grouped into these categories:
New product that allows higher distance and more powerAlmandine manganese alloy golf head
Currently being mass produced in the world; scoring perfect in all the evaluations to win the best iron award of 2006 to 2007
The nano doublecrystal structure and the grain boundary junction of the crystal structure can effectively perform hysteresis on the copper atoms to cause migration of the electrons. This knowledge is further expanded to understand that the high density nano doublecrystal structure can be introduced to the copper wire of the integrated circuit wafer to effectively decrease the chances of failure of the microchip caused by the electron migrations. This new understand and discovery is crucial to the development and evolution of the integrated circuit wafer technologies.
Possesses the complete set of production equipment to manufacture IIIV semiconductors components (CSD Lab)
As well as possessing molecular beam epitaxy (MBE) and metal organic chemical vapor deposition (MOCVD). Using the advantages of the two to accurately mature the complicated structure (CSD Lab).
Productions and applications of modern photoelectric materials
Integrated circuit's application of plasma enhanced atomic layered chemical vapor deposition (PEALCVD)
Smart Nano process structure and properties of the drug carrier
Smart biological signalinducing drug delivery system used to treat epilepsy diseases
Titanium dioxide Nanotube array for UV light sensing element
Key to longlasting semiconductor wafer: High density nano double crystal structure
The nano doublecrystal structure and the grain boundary junction of the crystal structure can effectively perform hysteresis on the copper atoms to cause migration of the electrons. This knowledge is further expanded to understand that the high density nano doublecrystal structure can be introduced to the copper wire of the integrated circuit wafer to effectively decrease the chances of failure of the microchip caused by the electron migrations. This new understand and discovery is crucial to the development and evolution of the integrated circuit wafer technologies.
High resolution electron transmissive microscopic image of copper atoms undergoing electromigration in the nano double crystal structure
This study was published in Science 321, 1066 (2008).
There are many different types of materials in this world, however they can be roughly grouped into these categories:
- Nano
- Polymer
- Metal
- Theoretical Calculation
- Energy
- Ceramic
- Electronic
- Semiconductor
- Biomedical
- Optoelectronic
New product that allows higher distance and more powerAlmandine manganese alloy golf head
Currently being mass produced in the world; scoring perfect in all the evaluations to win the best iron award of 2006 to 2007
The nano doublecrystal structure and the grain boundary junction of the crystal structure can effectively perform hysteresis on the copper atoms to cause migration of the electrons. This knowledge is further expanded to understand that the high density nano doublecrystal structure can be introduced to the copper wire of the integrated circuit wafer to effectively decrease the chances of failure of the microchip caused by the electron migrations. This new understand and discovery is crucial to the development and evolution of the integrated circuit wafer technologies.
- Product comparison between aluminum alloy and stainless steel
- High level of strength and toughness
- High fluidity causing increase in production yield
- High damping ratio (high damping energy) causing a better control on the hit
- High value of Young’s modulus (high rebound potential energy), increasing driving distance
- Low density, allowing the design of the gold head to be more diverse
- Crisp sound upon strikingApplications of nanoparticles and polymeric materials in optoelectronics component
- Includes analyzing selfassembled arrangements of the nanostructure between nanoparticles and polymeric materials. Using nanoparticles’ quantum effect and photoelectric effect matching with optical polymer to go with lightemitting diodes, solar batteries, field effect transistors, and many more optoelectric components.
Possesses the complete set of production equipment to manufacture IIIV semiconductors components (CSD Lab)
- Cellular phones and wireless communications
- Satellite communications and space applications
- Automotive collision avoidance radar
- Carefully selected
- Phasedarray radar
As well as possessing molecular beam epitaxy (MBE) and metal organic chemical vapor deposition (MOCVD). Using the advantages of the two to accurately mature the complicated structure (CSD Lab).
- Laser diode
- Lightemitting diode
- Solar battery
Productions and applications of modern photoelectric materials
- LED TV wall display
- LED decorative lights
- LED solar street lights
- LED manufactured traffic signals
Integrated circuit's application of plasma enhanced atomic layered chemical vapor deposition (PEALCVD)
- Reactant absorbed by the substrate
- Vacuum the Ar gas to clean the surface
- Surface reaction
- Vacuum the Ar gas to clean the surface
- Applications of thermoelectric materials
- Advantage High durability, no additional working components, low pollution, low maintenance cost, and high reliability
- Disadvantage Low conversion efficiency
- Improvement Nano Nano film (twodimensional material), Nano line (onedimensional material)
- Thermoelectric air conditioning
- Thermoelectric generator
- 60 nm Bi0.5Sb1.5Te3 Nano line
Smart Nano process structure and properties of the drug carrier
- drug carrier
- normal cells
- magnet
- cancer cell
- magnetic nanoparticles
Smart biological signalinducing drug delivery system used to treat epilepsy diseases
Titanium dioxide Nanotube array for UV light sensing element
- Anodized Aluminum hole template for creating a Carbon nanotube field emission element
- Anodized Aluminum hole template manufactured on Silicon chip
- Carbon nanotube growing on the anodized Aluminum hole template
- Field emission element lighting test
- Field emission element tripolar structure
- Hole template
- Carbon nanotube
- Polysilicon
- Silica
- Silicon chip
- Field emission tripolar array
Key to longlasting semiconductor wafer: High density nano double crystal structure
The nano doublecrystal structure and the grain boundary junction of the crystal structure can effectively perform hysteresis on the copper atoms to cause migration of the electrons. This knowledge is further expanded to understand that the high density nano doublecrystal structure can be introduced to the copper wire of the integrated circuit wafer to effectively decrease the chances of failure of the microchip caused by the electron migrations. This new understand and discovery is crucial to the development and evolution of the integrated circuit wafer technologies.
High resolution electron transmissive microscopic image of copper atoms undergoing electromigration in the nano double crystal structure
This study was published in Science 321, 1066 (2008).