演講題目 : Materials issues and proposed solutions for LSI interconnection
演講者 : Junichi Koike
服務單位 : Dept. of Materials Science, Tohoku University, Sendai, Japan
The seminar deals with critical issues related to LSI interconnection at various stages of technology advancement. We have tackled these issues by developing new materials and processes. I will explain how we searched new materials and evaluated their properties in the following three topics.
(1) Cu-Mn alloy to realize a self-forming barrier layer.
(2) Co-Ti alloy to realize low contact resistivity and to prevent silicide encroachment in FinFET devices.
(3) Intermetallic compounds for copper alternatives in 7 nm node and beyond.